300*300mm PCB (printed circuit board) Depaneling using UV
Laser,SMTfly-6 Features:
Pre-camera vision product position registration and model check;
More quick and easy, shorten the delivery time;
High quality ,no distortion,surface clean& uniformity;
Gathering the CNC tech laser tech software tech…High accuracy High
speed.
300*300mm PCB (printed circuit board) Depaneling using UV
Laser,SMTfly-6 Specification:
| Laser | Q-Switched diode-pumped all solid-state UV laser |
| Laser Wavelength | 355nm |
| Laser Power | 10W/12W/15W/17W@30KHz |
| Positioning Precision of Worktable of Linear Motor | ±2μm |
| Repetition Precision of Worktable of Linear Motor | ±1μm |
| Effective Working Field | 300mmX300mm(Customizable) |
| Laser Scanning Speed | 2500mm/s (max) |
| Galvanometer Working Field Per One Process | 40mmх40mm
|
PCB Depanelizer Machine-Custimed Offline Laser Pcb Depaneling Machine Description:
PCB depaneling (singulation) laser machines and systems have been
gaining popularity over recent years. Mechanical
depanaling/singulation is done with routing, die cutting, and
dicing saw methods. However, as the boards get smaller, thinner,
flexible, and more sophisticated, those methods produce even more
exaggerated mechanical stress to the parts. Large boards with heavy
substrates absorb these stresses better, while these methods used
on ever-shrinking and complex boards can result in breakage. This
brings lower throughput, along with the added costs of tooling and
waste removal associated with mechanical methods.
Increasingly, flexible circuits are found in the PCB industry, and
they also present challenges to the old methods. Delicate systems
reside on these boards and non-laser methods struggle to cut them
without damaging the sensitive circuitry. A non-contact depaneling
method is required and lasers provide a highly precise way of
singulation without any risk of harming them, regardless of
substrate.
Advantages of Laser PCB depaneling/singulation:
- No mechanical stress on substrates or circuits
- No tooling cost or consumables.
- Versatility – ability to change applications by simply changing
settings
- Fiducial Recognition – more precise and clean cut
- Optical Recognition before PCB depaneling/singulation process
begins.
- Ability to depanel virtually any substrate. (Rogers, FR4, ChemA,
Teflon, ceramics, aluminum, brass, copper, etc)
- Extraordinary cut quality holding tolerances as small as < 50
microns.
- No design limitation – ability to cut virtually and size PCB board
including complex contours and multidimensional boards
Sample for PCB Depaneliztion Solutions-PCB Separator:
